| 摘要 |
<p>PURPOSE:To prevent a burr from falling off and to reduce a defect by a method wherein a lead frame on which a semiconductor chip is mounted is formed by a stamping operation and a shaping operation and, when a wire is attached to its end part, a protrusion is formed at a connecting part used to avoid contact with burrs produced at the connecting part of the wire and at a fracture face of the frame. CONSTITUTION:A lead frame 11 having a chip-mounting part 1 is formed by a stamping operation and a shaping operation; burrs 4 are produced at end parts. Burrs 4 are produced also at connecting parts 32 of wires 2. Consequently, when the frame 11 is bonded to the connecting parts 32, the burrs 4 fall off and it was not possible to avoid that defects such as a short circuit and the like are caused. By this method, in order to avoid this situation, protrusions 5 which are higher than the burrs 4 produced at the frame 11 are formed, by using a punch 12a, at end parts of the connecting parts 32. When the connecting parts 11 are fixed and bonded to the frame 11, it is possible to avoid contact with the burrs 4 thanks to the protrusions 5.</p> |
