| 摘要 |
An assembly of aligned, stacked, circuit boards for hot-pressing in an evacuated bag utilizes a sliding body formed of a thermoplastic material which is inserted into elongated peripheral board holes. The sliding body is dimensioned to allow the boards to be slideable in a longitudinal direction at the direction of the sliding body to allow thermal expansion to be compensated for. Disclosed is a tool for reforming the slilding body after insertion into the board holes has a cylindrical heating element with a central bore in which a centering pin is located. The heating element is surrounded by a tubular device which is biased in a sleeve by a compression spring. Application of the tool against the inserted sliding body causes heat forming of a portion of the sliding body to maintain the circuit boards in registry during the hot-pressing period.
|
