| 摘要 |
<p>PURPOSE:To enhance connection reliability by a simple process by a method wherein an inner lead of a tape carrier is bonded directly to a connecting pad of a semiconductor chip. CONSTITUTION:A semiconductor chip 1 which is provided with an Al connecting pad 4 and whose insulating film 5 is passivation-treated is prepared; a two-layer TAB tape and a three-layer TAB tape corresponding to the chip 1 are manufactured. Regarding the two-layer TAB tape, a Cu layer is formed directly on one face of a polyimide film 3; the Cu layer is etched to form a Cu pattern; an opening part is formed in the film 3. Regarding the three-layer TAB tape, an Al layer is formed on one face of the film 3 via an adhesive layer; the Al layer is etched to form an Al pattern whose size is the same as that of the two-layer TAB tape; an opening part is made in the film 3. Then, an inner lead 2 of a tape carrier is bonded to the Al connecting pad 4 of the chip 1 under prescribed conditions.</p> |
