| 摘要 |
PURPOSE:To flatten laminated respective layers so as to prevent generation of break-down of a conductor pattern at the time of mounting by removing only the part of a conductor pattern, on which an organic insulating layer and a resist film are formed, to expose an insulating substrate and giving a conductor film to the exposed part to remove the resist film and the conductor film thereon for forming the conductor pattern. CONSTITUTION:An organic insulating layer 12 and a resist film 14 are piled on the surface of an insulating substrate 1, only the conductor pattern formation part, on which the resist film 14 and the organic insulating layer 12 are formed, are removed to expose the insulator 1 for providing conductor films 13 having the same thickness with the organic insulating layer 12 on the upper face of the exposed face of the insulating substrate 1 and the resist film 14. Next, the resist film 14 and the conductor film 13 on the upper face of the resist film 14 are removed to form a prescribed conductor pattern 15. Then, after providing an inorganic insulating layer 6 on the upper face thereof, formation of the conductor pattern 15 is repeated. |
