发明名称 ELECTRIC CIRCUIT PACKAGE AND METHOD FOR MAKING ELECTRIC CIRCUIT PACKAGE
摘要 <p>PURPOSE: To form an electrical connection from a first place to a second place by defining a plurality of openings in a thin sheet-like support made of an insulating high temperature polymer and remelting a conductive means filling the opening. CONSTITUTION: Pad supports 12, 16 are made of an insulating material and first and second places are typically made of a copper foil or an equivalent material. A support 14 is made of a thin insulating material and has a plurality of openings 26 filled with a conductive means 26, e.g. a remelting solder or a conductive paste. A pattern of opening 26 and some conductive means 28 in the openings are arranged such that the openings 26 are placed between surface regions defining respective pairs of place when the first and second pad supports 12, 16 are sandwiched. Thermally remelted conductive means 28 adheres to first and second pairs of pad 18, 22, 20, 24 to form electrical interconnections 18-36-22, 20-38-24.</p>
申请公布号 JPH03204964(A) 申请公布日期 1991.09.06
申请号 JP19900115311 申请日期 1990.05.02
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 JIEROOMU ARUBAATO FURANKENII;RICHIYAADO FURANSHISU FURANKENII;KAARU HAAMAN;RORUFU USUTOROO
分类号 H01L23/32;H01R4/02;H05K3/32;H05K3/34;H05K3/36;H05K3/40;H05K13/04 主分类号 H01L23/32
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