| 摘要 |
<p>PURPOSE:To exclude the concentration of stress caused by thermal shock even in the case where conductor circuits are constituted of thin wires, and to eliminate the possibility of discontinuity, by arranging an intermediate metal coating film which is formed by stretching a metal coating film for connection terminals and has a similar thermal expansion coefficient, on the surface of the conductor circuits where a dam frame is arranged. CONSTITUTION:An electronic parts mounting board is constituted of the following; an electronic parts mounting part 8 formed on an insulating board 90, a plurality of conductor circuits 91 stretching form the periphery of the mounting part 8 to the upper part of the board, and through holes 97 formed at the tip parts. A metal coating film 10 for electronic parts connection terminals is formed on the surface of the board of the circuits 91 on the periphery of the mounting part 8. It is to be noted here that the coating film 10 is continuously formed as far as the part slightly outer than the junction part of a dam frame 82, toward the direction of the hole 97, and an intermediate metal coating film 101 is formed at the part facing the dam frame 82. The dam frame 82 is bonded to the coating film 101 via a second insulating film 21 and adhesive agent 83, and a first insulating film 96 is formed between the coating film 101 and an Ni-Au plated layer 14 of the hole 97.</p> |
