| 摘要 |
PURPOSE: To enhance integration and the step coverage of a conductor film while preventing short-circuiting between a conductive film and a conductor by making an opening in an insulating film laminate part including a conductor laminated on a substrate, forming an insulating film on the side face of the opening and then covering the entire surface with a conductive film. CONSTITUTION: An insulating film and conductors 11, 12 and 13, 14 are laminated on a semiconductor substrate 10 and an opening is made to expose the substrate 10 before forming spacers 18a, 18b of insulating film on the side wall of the opening. When the entire surface is coated with a conductive film 20, the film 20 and the conductor 12 are prevented from being short-circuited. Furthermore, the step coverage at the opening of the film 20 is enhanced because of the spacers 18a, 18b while enhancing integration through a self-aligning technology. |
