| 摘要 |
PURPOSE:To manufacture a semiconductor device, in which bonding positions are stable, by a method wherein projected parts are previously formed on the surface of an element as bonding regions by etching or the like and a bonding is performed in the decided positions. CONSTITUTION:In a transistor element 1, a collector layer C is used as a base, a base layer B and an emitter layer E are formed, openings are respectively formed in the surfaces, which are covered with an oxide film 2, of these layers B and E and a base electrode 3 and an emitter electrode 4 are formed through deposition of a metal. After that, circular projected parts 3a and 4a are further formed on these electrodes by etching, these projected parts are detected by a pattern recognition device of a bonding device and fine metal wires 5 are respectively bonded correctly on the projected parts 3a and 4a. Since predetermined positions are bonded, an unsatisfactory state due to the failure of bonding positions or the like can be eliminated. |
