| 摘要 |
Apparatus for reflow soldering of component leads is disclosed, in which a heater bar is positionable above the leads. A guide is positionable outside of the leads parallel to the heater bar, and the apparatus moves the guide downwardly to contact the printed circuit board. The guide is adapted to rock within its plane. The heater bar is moveable up and down within the guide, and is free to rock with the guide, but is not permitted to rock independently of the guide. Instead, its vertical movement is within a track in the guide. Proper alignment of the guide thus produces proper alignment of the heater bar. In the preferred embodiments, the heater bar and guide are mounted at the lower end of a quill assembly. As the quill assembly is lowered towards the circuit board, the guide first comes into contact with the circuit board and pivots to the proper alignment, thereby aligning the heater bar as well. Further downward movement of the quill assembly then brings the heater bar into contact with the leads, correctly aligned by virtue of the cooperation between the guide and the heater bar. |
