| 摘要 |
This invention relates to the use of a plasma arch furnace for the heating of gases, liquids and solid materials. There is provided a closed circulation loop where the gas or the gas mixture in the loop is controlled with regard to composition, pressure and temperature to achieve optimal chemical processing of materials which are fed into the loop. The reacting gas is fed into the loop in stochiometric quantities to avoid simultanous presence of nitrogen and oxygen in the plasma arch furnace. The basic carrier ga may be any one optimal for the process. |
