| 摘要 |
PURPOSE:To reduce a transmission loss due to the influence of resist exerted upon an electric field by preventing the resist formed on a conductor from being applied from the conductor to a substrate. CONSTITUTION:The resist 1 is formed only on a microstrip line 12 and prevented from being applied from the line 12 to the dielectric substrate 11. Since no resist 1 exists on the boundary part between the line 12 and the substrate 11, the electric field on the boundary part is not influenced by the resist 1. Thereby a transmission loss due to the resist 1 does not occur in the line 12. Since the gap A between the left end of the resist 1 and that of the line 12 is properly narrowed, no soldering is stuck to the gap A. On the other hand, the gap B between the right end of the resist 1 and that of the line 12 is sufficiently wide, permitting the adhesion of soldering. |
