| 摘要 |
The lead frame comprises a die pad 11 an which is mounted a semiconductor chip 12. The pad is connected by a lead 13 to a common bar 15. At least one side-lead 14, terminating in a connector 14a is also attached to the common bar. The length L12 of the side-lead is such that it extends as far as the nearest part of the pad preferably up to or beyond a line level with the furthest part of the pad. This protects the pad from sideways movement during encapsulation, which could otherwise damage the wire interconnection between the pad and side-leads. <IMAGE> |
