| 摘要 |
<p>At least part of each protective layers (1,4a,4b,5a,5b,6a,6b,6c,7,8a,8b) disposed outside the capacitance generating portion (2) of a film capacitor is of a substantially-unoriented polyphenylene sulphide film (10). The unoriented polyphenylene sulphide film (10) does not shrink substantially even when heated on thermal bonding and soldering and on the contrary absorbs deformation of the other part of the layer due to thermal shrinkage. Therefore, stability of bonding inside the protective layer and dimensional stability of the protective layer can be secured.</p> |
