发明名称 |
LODDEMIDDEL-FORHAANDSFORM FOR FREMSTILLING AV EN ELEKTRISKFORBINDELSE, FREMGANGSMAATE FOR FREMSTILLING AV FORHAANDSFORMEN, OG EN INNRETNING FOR SAMMENKOPLING AV ELEKTRISK LEDENDE ELEMENTER. |
摘要 |
<p>A chip carrier mounting device which is hereinafter also referred to as an "interconnection preform placement device" includes a retaining member having a predetermined pattern of apertures in which are positioned preforms of joint-forming material such as solder. The preform retains its general configuration after the interconnection or soldering process to form a resilient joint which is more capable of withstanding stress, strain and fatique. A method of forming resilient interconnections comprises placing the interconnection retaining member device between parallel patterns of electrically conductive elements, such as the conductive pads on an electronic component and a circuit board, and effecting the bonding of the conductive elements with the preforms. The joint-forming material may be a filled solder composition or a supported solder which substantially maintain their physical shape when the solder is molten, or a conductive elastomer.</p> |
申请公布号 |
NO166826(C) |
申请公布日期 |
1991.09.04 |
申请号 |
NO19840002647 |
申请日期 |
1984.06.29 |
申请人 |
RAYCHEM CORPORATION |
发明人 |
ALLEN, LESLIE JOHN;CHERIAN, GABE;DIAZ, STEPHEN H. |
分类号 |
B23K3/06;B23K35/02;H05K3/32;H05K3/34;H05K3/40;H05K13/04;(IPC1-7):H01R43/02;H01R4/02 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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