发明名称 |
COMPOSITE CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME |
摘要 |
The composite circuit board comprises a substrate (13) made of an insulating material, a thick circuit conductor (11), embedded in this substrate (13), which includes a parts-mounting section (11a) and has a predetermined circuit pattern, a thin circuit conductor (12), provided on the surface of said substrate (13), which includes a land (12a) corresponding to the parts-mounting section (11a) of said thick circuit conductor (11) and has a predetermined circuit pattern, and a conductor means (14, 14a) for electrically connecting said land and said parts-mounting section. In this circuit board, the land (12a) and the part-mounting section (11a) are connected by a conducting member provided in this through hole (14). <IMAGE> |
申请公布号 |
EP0430157(A3) |
申请公布日期 |
1991.09.04 |
申请号 |
EP19900122636 |
申请日期 |
1990.11.27 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
YAMAMOTO, MASAAKI;YATABE, HIROSHI;KOBAYASHI, KENZO;MOCHIZUKI, HAJIME |
分类号 |
H01L21/48;H01L23/538;H05K1/00;H05K1/02;H05K3/20;H05K3/42;H05K3/46;(IPC1-7):H01L23/538 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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