| 摘要 |
<p>PURPOSE:To avoid a decrease in the mounting density of a wiring pattern or a restriction in the design of a pattern due to laser light irradiation by providing another resin board mixed with fine particles having properties for reflecting a laser light therein between a circuit block and the board. CONSTITUTION:A laser light is emitted to a first resin board 13 near a wiring pattern 17 on the surface of a circuit block 15, fine cooper particles in the board 13 are melted to electrically connect the leads 12a of an electric component 12 to the pattern 17. A second resin board 14 containing fine particles of TiO2 for reflecting a laser light therein is interposed between the board 13 and the block 15. Thus, even if the laser light is emitted to the board 13 near the pattern 17 on the surface of the block 15, the light is reflected on the board 14, and melting of a wiring pattern 16 on the surface of the block with the light can be avoided. Accordingly, a decrease in the mounting density of the pattern can be avoided to improve the degree of freedoms of pattern design.</p> |
