发明名称 |
Installation structure of integrated circuit devices |
摘要 |
An installation structure of integrated circuit devices, in which two or more types of integrated circuit devices of different base materials are installed onto the same installation substrate. Since the installation structure has a construction according to different characteristics such as a thermal conductivity, heat generation amount, thermal expansion coefficient and the like of the integrated circuit devices made of different materials, the reliability of each device and its connection and the reduction of the costs required for the cooling method can be presented.
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申请公布号 |
US5045922(A) |
申请公布日期 |
1991.09.03 |
申请号 |
US19900583144 |
申请日期 |
1990.09.17 |
申请人 |
HITACHI, LTD. |
发明人 |
KODAMA, HIRONORI;OGIHARA, SATORU;ARAKAWA, HIDEO;INOUE, HIROKAZU;YASUTOMI, YOSHIYUKI;MIYOSHI, TADAHIKO |
分类号 |
H01L25/18;H01L23/538;H01L25/04;H01L25/065;H01L25/10;H05K1/02;H05K1/03;H05K1/14;H05K1/18 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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