| 摘要 |
<p>PURPOSE:To lengthen a lifetime, and to increase the number of semiconductor wafers loaded by forming a plurality of silica pipes, to which a plurality of trench sections for placing semiconductor wafers are formed, which are arranged in parallel and both end sections of which are opened and on the insides of which reinforcing bars, on which the films of silicon carbide are attached through chemical vapor deposition respectively and which are made of silicon carbide, are disposed, by connection by a plurality of quartz struts. CONSTITUTION:A stacking boat 10 is composed of two quartz pipes 11A, 11B, in which semiconductor wafers M are inserted and held in a plurality of trench sections 11a, 11b formed at opposed positions, and quartz struts 12A, 12B connecting the quartz pipes 11A, 11B at both end sections. Both end sections of the quartz pipes 11A, 11B are opened, and the insides have reinforcing bars 13A, 13B, on which the films of silicon carbide are attached through chemical vapor deposition extending and reinforcing the quartz pipes 11A, 11B up to sections near both end sections and which are made of silicon carbide. Accordingly, even when the heat treatment temperatures of the semiconductor wafers M exceed the softening point of quartz, deformation can be inhibited, the quartz struts can be removed from an intermediate section, a lifetime is lengthened, and the semiconductor wafers M loaded can be increased. The closing treatment of both end sections of the silica pipes is avoided simultaneously, thus facilitating manufacture.</p> |
