| 摘要 |
<p>PURPOSE:To offer and chip-type electronic component which can be easily mounted on a board by a method wherein an adhesive agent is applied onto the mounting face of the component. CONSTITUTION:A silicone adhesive agent 5 is applied onto the mounting face of a chip resistor 3 excluding an electrode through a printing method. A polyester film 6 to which a releasing agent is applied is pasted on the adhesive face of the resistor 3 as a releasing film. First of all, the releasing film 6 is separated at mounting, the mounting face of the resistor 3 or the adhesive agent applied face is tentatively fixed to a mounting board 1. The surface mounting of a chip-type component is carried out on a board by soldering 4.</p> |
