| 摘要 |
<p>PURPOSE:To approximately securely prevent a lead from floating at the time of joint by a method wherein each lead is subjected to thermoelastic martensitic transformation exhibiting a shape memory effect at a temperature higher than room temperature and lower than soldering temperature as well as is formed of shape memory alloy having conductivity. CONSTITUTION:Each lead 3 of a flat package IC 3 is mounted on soldering paste 54 adhered on a pad 53 on a board 51. Even if a lead 32 is deformed and floated upward, the lead which is deformed at the time of heating wherein the lead is passed through a re-flow furnace as a heating means reaches a temperature of martensitic transformation or higher and is restored to an original state before the deformation by a shape memory effect so that contact faces 3b of all leads 3a are positioned on the same plane. At the same time the soldering paste 54 is melted, all the leads 3 are uniformly soldered and after the lead is passed through the re-flow furnace it is cooled to have the solder solidified so that the pad 53 and the lead 3 are electrically (and mechanically) connected to each other.</p> |
