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发明名称
RESIN SEALED SEMICONDUCTOR DEVICE PROVIDED WITH LIQUID EPOXY COMPOSITE
摘要
申请公布号
JPH03201466(A)
申请公布日期
1991.09.03
申请号
JP19890338197
申请日期
1989.12.28
申请人
OKI ELECTRIC IND CO LTD
发明人
HIRAYAMA HIROKI
分类号
C08L63/00;C08G59/00;C08G59/62;C08K5/54;C08K5/5419;C08K5/544;H01L23/29;H01L23/31
主分类号
C08L63/00
代理机构
代理人
主权项
地址
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