| 摘要 |
PURPOSE:To enable the light emitting section of an LED chip to be easily connected to an electrode through a usual thermo-sonic wire bonding by a method wherein a wire-bonding electrode correspondent to a light emitting section located at the end of an LED chip is formed inside the end face of the LED chip by a certain distance. CONSTITUTION:Each of wire bonding electrodes 13 is provided at a position inside a region inwardly distant from the end face of an LED chip 10 by a prescribed length of d4. Therefore, when the LED chip 10 is mounte on a wiring board 31, the wire bonding electrodes 13 hardly protrude outside of the wiring board 31 even at both its ends and all located on the board 31. In result, when the LED chip 10 is wire-bonded, heat is easily conducted and ultrasonic waves hardly decrease in effect, so that the wire-bonding electrodes 13 are easily connected to all light emitting sections 11 through a usual thermo-sonic wire- bonding method. |
