| 摘要 |
PURPOSE:To form a bump in a stable condition by a wire bonder by pressurizing and bonding a metal ball to a bonding pad, then cutting a metal wire by horizontally moving a capillary and feeding the metal wire by a prescribed quantity. CONSTITUTION:A capillary 2 is moved above a bonding pad 3 formed on a semiconductor element 4 and a discharge is performed between a torch electrode 5 and a metal wire 1 to form a metal ball 6. Thereafter, the metal ball 6 is made abut and pressurized against the bonding pad 3 by the capillary 2, bonded to the pad 3 by applying ultrasonic wave to the capillary 2 and the metal wire 1 is cut by horizontally moving the capillary 2. Then, after the capillary 2 is moved upward, the metal wire 1 is fed by a prescribed quantity to provide for the formation of the ball and is moved above the subsequent bonding pad. Thus, a whisker does not remain on the upper surface of a bump and, thereafter, by feeding the metal wire 1 by a prescribed quantity, the metal ball 6 can be formed in a stable condition. |
