SEMICONDUCTOR PACKAGE AND MANUFACTURE THEREOF,申请号JP19890342552-传众专利搜索

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发明名称	SEMICONDUCTOR PACKAGE AND MANUFACTURE THEREOF
摘要
申请公布号	JPH03200359(A)	申请公布日期	1991.09.02
申请号	JP19890342552	申请日期	1989.12.27
申请人	NARUMI CHINA CORP	发明人	MINO KATSUJI;YOKOCHI MASAO
分类号	H01L23/12;H01L23/50	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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