| 摘要 |
PURPOSE:To obtain a mullite-beta-spodumene combined body having thermal expandability close to that of silicon and utilizable as a substrate material in a semiconductor device by firing a molded body of a mixture of mullite with beta-spodumene at a specified heating rate. CONSTITUTION:When mullite is mixed with beta-spodumene preferably in (80:20)-(30:70) weight ratio and a molded body of the mixture is fired at 1,400-1,500 deg.C to obtain a mullite-beta-spodumene combined body, the molded body is heated from 900-1,100 deg.C to the firing temp. at 0.5-4 deg.C/min heating rate. |
