摘要 |
PURPOSE:To protect a circuit from overcurrent by inserting an overcurrent controlling means in a signal and current path for a semiconductor circuit. CONSTITUTION:An IC chip main body 4 of an IC chip module 1 is buried in a fixing card 10. Outer terminals 5 of the card are arranged on the surface of a substrate 1; through holes 6 are arranged on the peripheral part, trenches 8 corresponding with the through holes 6 are arranged on the rear. Bimetal 12 is buried in the trench 12, a pattern P is electrically connected with pads 13, 14 via the bimetal 12, and constitutes an overcurrent controlling part 2. The pads 13, 14 and the outer terminals 5 are connected by using bonding wires 7, and a current is applied to the chip 4. By the heat generated when an abnormal current flows, the bimetal is warped and exfoliated, so that the circuit is opened and the current of the IC chip is cut off. After the current is cut off, the bimetal returns to the original closed state as a result of natural cooling, so that overcurrent can be repeatedly prevented from flowing in the circuit. |