| 摘要 |
PURPOSE:To improve the extent of surface roughness in a workpiece so remarkably by grinding a grinding wheel or the workpiece as rocking it in a direction almost orthogonal with the ground feed direction within the range of the surface roughness of the workpiece. CONSTITUTION:A workpiece 3 such as a silicon wafer or the like is air-cut into rapid traverse grinding (rough grinding). Next, this workpiece 3 is ground at low speed feed (fine grinding) up to about 2.5mum in surface roughness. Afterward, the workpiece 3 is subjected to spark-out grinding, and a grinding wheel 1 or the workpiece 3 is ground as long as the specified time at a position returned to 1/2 or so (about 1.3mum or so) of the surface roughness of the workpiece 3 as rocking it by a rocking mechanism additionally installed in a grinding machine in an arrow B direction almost orthogonal with the grinding feed direction. In consequence, the surface roughness of the workpiece 3 is improved to the extent of less than about 1.5mum. |
