| 摘要 |
PURPOSE:To acquire an insulating layer of high reliability by forming one layer of insulating layers on a circuit pattern formed on an insulating substrate, of a dry film. CONSTITUTION:Circuit patterns 12, 14 are formed on an insulating substrate 10 and a desired solder resist film 16 is formed. An insulating film 20 is bonded in a range wherein a jumper line 18 is formed, and a film to form the jumper line 18 is formed thereon and connected to a desired circuit 14 of the circuit patterns 12, 14. Thereafter, an over coat 22 is further formed. Since one layer 20 of insulating layers 16, 18 is formed of a dry film, a thickness of the insulating film 20 can be decided arbitrarily, thereby eliminating possibility of development of pin holes in the film 20. A highly reliable insulating layer can be acquired in this way. |
