Soldering procedure for fixing an element as for example a substrate of a hybrid circuit on a heat dissipating base.

摘要

This procedure is such that the metallisation effected on the said element, and necessary for the behaviour (integrity) of the soldering, is effected according to a discontinuous pattern (4), such that the dimensions of the non-metallised areas (5) are reduced to dimensions which do not run the risk of deterioration of the said element in operation.