发明名称 SOLDERING FLUX.
摘要 <p>Flux comprises besides the activator: (1) a thermoplastic resin with a softening point of 80 deg.C or above and/or above, and/or (2) an expoxy cpd. a radical-polymerisable ethylenically unsatd. cpd. or a blocked isocyanate cpd., or (3) a thermosetting resin comprising both a carboxylated resin and an epoxy resin and/or a theromosetting resin comprising both a carboxylated resin and an epoxy resin and/or a thermosetting resin contg. both carboxyl and epoxy gps.</p>
申请公布号 EP0443030(A1) 申请公布日期 1991.08.28
申请号 EP19900912077 申请日期 1990.08.08
申请人 NIPPONDENSO CO., LTD.;HARIMA CHEMICALS, INC. 发明人 TAKEMOTO MASANORI;ONISHI TATSUSHI;AIHARA MASAMI
分类号 B23K35/363;B23K35/36 主分类号 B23K35/363
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