Radiation-sensitive resin composition.

摘要

The radiation-sensitive resin composition, containing an alkali-soluble resin, comprises 1,1-bis(4-hydroxyphenol)-1-phenylethane, 1,1,1-tris(4-hydroxyphenyl)ethane or a compound selected from a polyhydroxy compound having the following formula: <CHEM> and quinonediazidesulfonates of the polyhydroxy compound, and the like. The radiation-sensitive resin composition is suitable for use as a positive type photoresist which has such excellent developability as to inhibit effectively the generation of scum in the formation of a photoresist pattern, has high sensitivity and is excellent in heat resistance and remained thickness ratio upon development.