| 摘要 |
<p>PURPOSE:To improve the adhesion of a wafer with a photomask for contact exposure by housing the swollen part of a resist in a recessed groove by forming the recessed groove at a part equivalent to the outer peripheral part of the wafer. CONSTITUTION:The photomask 30 for contact exposure is to be adhered to the wafer 10 to which the resist 20 is applied, and the recessed groove 31 is formed at the part equivalent to the outer peripheral part 12 of the wafer 10. The recessed groove 31 is formed a little larger than the swollen part 21 of the resist 20 formed at the outer peripheral part 12 of the wafer 10. When the photomask 30 for contact exposure is adhered to the wafer 10, it is comprised so that the swollen part 21 formed on the wafer 10 can be housed completely in the recessed groove 31. Thereby, the photomask can be adhered to the wafer 10 completely.</p> |
