| 摘要 |
<p>PURPOSE:To provide surface wirings of high density with high reliability by putting a wiring pattern of silver material conductive to the inner wiring and another wiring pattern consisting of a copper material side by side on the surface of a ceramic substrate. CONSTITUTION:A multilayer wiring substrate 1 is provided with a substrate proper 2, inner wirings 3 and surface wirings 4. Here, the surface wirings 4 are formed of a copper conductive material, and the surface wirings 3 are independently provided with no connection to the inner wirings 3. Consequently, inconvenience such as defective connection or short circuit caused by eutectic or the like of the copper conductive material and the silver conductive material at the connection part of both wirings 3 and 4 is excluded from being generated. Thereby, the surface wirings 4 of high density can be provided and a highly reliable multilayer wiring substrate 1 can be obtained.</p> |
