| 摘要 |
PURPOSE:To demold a molded product from a mold without applying stress by demolding a resin sealed molded product by sending compressed air in upper and lower cavities. CONSTITUTION:In such a state that a semiconductor element 6 is sealed with a resin, upper and lower molds 1, 2 are clamped. When both molds are opened, compressed air 11a is allowed to flow in the air passage 9a provided to the upper mold 1 by a compressed air supply means and a valve 10a is operated upwardly to allow the compressed air 11a to flow in an upper cavity 3. In this state, the lower mold 2 is allowed to fall. By this operation, a package 7 is demolded from the upper cavity 3. Next, compressed air 1b is sent in an air passage 9b to operate a valve 10b downwardly to be allowed to flow in a lower cavity 4. In this state, the demolding of the package 7 from the lower cavity 4 is completed. By this constitution, a molded product can be demolded without applying stress to the semiconductor element and the package. |
