| 摘要 |
<p>A motion sensor, in particular for measuring oscillating, tilting or accelerated motion, is manufactured from a monocrystalline silicon wafer. At least one vertical paddle perpendicular to the wafer surface, which is capable of oscillating in the plane of the wafer, is etched out of the silicon wafer. Means for evaluating the deflection of the at least one paddle are also provided. The front face and rear face of the silicon wafer are (110) surfaces and the delimiting side walls of the etched depression are (111) surfaces. The at least one paddle is arranged in function of the crystallographic angles which form the (111) planes with and in the (110) plane.</p> |
