| 摘要 |
PURPOSE:To make it possible to make low the mounting height of a semiconductor device and moreover, to make it possible to make small the mounting area of the device by a method wherein wires having a length of a dimension almost identical with the thickness of a mounting board are formed at positions to correspond to pads and are respectively inserted in through holes connected with inner leads on the board. CONSTITUTION:Wires 12 are almost vertically bonded on aluminium pads 11 on a semiconductor device 10 and the length of the wires 12 is cut into a dimension almost identical with the thickness of a mounting board 13. These wires 12 are respectively inserted in through holes 14 formed in the board 13, are fixed with a conductive paste (a bonding agent) 15 and at the same time, are electrically connected with the pads 11. The holes 14 are respectively connected with inner leads 16 formed on the board 13. By inserting the wires 12 in the holes 14 in the board 13 in such a way, the mounting height of the device 10 can be made low. Moreover, as a second wire bonding on the inner leads is also unnecessary, the space of the board 13 which is positioned under the lower part of the device 10 can be effectively put to practical use and the mounting area of the device can, be made small. |
