Resin molding apparatus.

摘要

A resin molding apparatus for molding an insulating resin mold at the peripheral portion of a semiconductor wafer comprises an upper metallic mold (7), and a lower metallic mold (8) which clamps the semiconductor wafer (10) with the upper metallic mold (7). The upper and lower metallic molds (7, 8) form a resin space (20) at the portion corresponding to the peripheral portion of the semiconductor wafer (10). The contact surfaces (7a, 8a) of the upper and lower metallic molds (7, 8) in contact with the semiconductor wafer (10) and the inner surface (7a, 8a) of the resin space (20) are coated with elastic material (22) which does not adhere to the insulating resin (2).