| 摘要 |
PURPOSE:To execute an assembly operation without lowering a yield and to comply with many types of lead frames by a method wherein a main part of an inner lead is formed by using a resin film formed of a metal thin-film wiring and a semiconductor element is fixed onto the inner lead via an insulating adhesive layer. CONSTITUTION:Main parts of inner leads 13 are constituted of the following: a resin film 1A such as a polyimide film or the like; and and a metal thin-film wiring 1B such as a copper-foil wiring or the like which is formed on the resin film 1A by a plating operation or an etching operation. In this case, a semiconductor element 11 is fixed directly onto the metal thin-film interconnection 1B on the film 1A by suing an insulating paste 1C; and after that, by using bonding wires 12 the semiconductor element 11 is connected electrically to the metal thin-film wiring 1B on the film 1A and the metal thin-film wiring 1B on the film 1A is connected electrically to a lead frame 15. Thereby, since the fine processing property of an wiring pattern is excellent, the limitation on a package designing operation and on an assembly process of ultramultipin types is reduced, and an assembly operation can be executed without lowering a yield. |
