| 摘要 |
PURPOSE:To prevent an exfoliation of a mounting part from a resin interface and to prevent occurrence of quality deterioration due to a crack of a resin by a method wherein a drainage cavity is formed in the lower part of a semiconductor element by using the following: an internal lead for semiconductor-element mounting use; a film formed on the surface of the internal lead; and a water-permeable thin film formed on the rear surface of the internal lead. CONSTITUTION:A film 16B having a double-sided adhesive is pasted on the surface of two internal leads 12A for semiconductor-element mounting use and a water- permeable thin film 15 is pasted on the rear surface of the internal leads 12A so as to cover a face surrounded by the two internal leads 12A of a lead frame 11; and a semiconductor element 14 is fixed and bonded via a bonding face 16A of the film 16B. A drainage cavity 19 is formed in the lower part of the semiconductor element 14 by using the internal leads 12A, the thin film 16B and the water-permeable thin film 15; and a space by which the drainage cavity 19 can be connected to the outside is provided. Consequently, steam generated by a thermal shock at a mounting operation on a printed-circuit board is discharged to the outside of a package. Thereby, it is possible to prevent generation of a crack and a defect such as an exfoliation at an interface inside the package; and a quality can be enhanced. |
