发明名称 METHOD OF MANUFACTURING THICK-FILM DEVICES
摘要 A method of fabricating a multilayer ceramic device of the type which has conductive paths in parallel planes spaced by a dielectric including hollow microspheres of glass, uses the steps of separately applying to a ceramic substrate (12), a green ceramic tape (16) and a layer of hollow microspheres; the resulting structure is fired. The dielectric constant between the conductive paths is thus reduced, resulting in low capacitance and increased speed of circuitry.
申请公布号 EP0405947(A3) 申请公布日期 1991.08.21
申请号 EP19900307037 申请日期 1990.06.27
申请人 DIGITAL EQUIPMENT CORPORATION 发明人 KELLERMAN, DAVID
分类号 C04B38/00;H01L21/48;H01L23/498;H01L23/64;H01L27/01;H05K1/03;H05K3/46;(IPC1-7):H01L21/48 主分类号 C04B38/00
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