| 摘要 |
PURPOSE:To make it possible to realize a highly reliable high-density connection by a method wherein bumps on the individual pads of a semiconductor chip mounted providing the pads on its upper surface are fitted in through holes in a wiring film and the bumps are fused to connect the individual wiring patterns of the wiring film to the pads on the upper surface of the chip. CONSTITUTION:In respect to the side of a semiconductor chip 20 in a wiring film 40, bumps 23 are fitted in through holes 44 and the individual holes 44 are positioned in such a way as to oppose to pads 22 and are fixed by adhesion. Also in respect to the side of a package 30 in the film 40, bumps 32 are fitted in through holes 45 in the same way and the individual holes 45 are positioned in such a way as to oppose to wiring patterns 31 and are fixed by adhesion. Then, the bumps 23 and 32 are temporarily heated at the melting point or higher of the bumps 23 and 32 through a reflow furnace. Thereby, the bumps 23 and 32 are fused, the holes 44 and 45 are filled and at the same time, the fused bumps cover the sides of the openings in the upper surfaces of the holes and are welded to wiring patterns 43 at the peripheral parts of the holes 44 and 45. |
