| 摘要 |
PURPOSE:To perform easy and positive soldering with thick solder deposited by arranging several curve-shaped recessed portions on the surface of a portion used in insertion into a mother board, etc. CONSTITUTION:On the surface of a terminal pin 1 which is to be a portion used in insertion into a mother board, etc., curve-shaped recessed portions 2 are arranged at equal spaces. Soldering to the terminal pin 1 is made in such a manner that the terminal pin 1 is inserted into a through-hole which is formed in a pin grid array PGA and a portion, which is used in insertion into the mother board projected from a PGA plate and the other electric/electronic installations and which has the surface provided with the curve-shaped recessed portion 2, is immersed in a solder reservoir which is heated and melted to fix the terminal pin 1 which is inserted into the through-hole in the PGA plate to the PGA plate with soldering and at the same time to pick up the immersed portion out of the solder reservoir. At this time, the curve-shaped recessed portion 2 provides anchor effect to allow thick solder 3 and easy and positive soldering. |
