MANUFACTURE OF SOLDER BUMP,申请号JP19890330006-传众专利搜索

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发明名称	MANUFACTURE OF SOLDER BUMP
摘要
申请公布号	JPH03190138(A)	申请公布日期	1991.08.20
申请号	JP19890330006	申请日期	1989.12.19
申请人	FUJITSU LTD	发明人	NAKANISHI TERU;KARASAWA KAZUAKI;OCHIAI MASAYUKI
分类号	H01L21/60;H01L21/321	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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