| 摘要 |
An apparatus for cooling circuit modules by use of a thermo-electric device which comprises a series of semiconductor regions and etched copper conductors designed to conduct heat in a specified direction by means of the Peltier Effect. The thermo-electric device is sandwiched between two layers of a polymer based, thermally conductive dielectric such as the dielectric used in the manufacture of Thermal Clad TM . The hot layer of Thermal Clad TM (i.e., the layer that receives heat) is laminated directly to a heat sink. The cold layer of Thermal Clad TM is laminated directly to a cold plate which is, in turn, coupled to the circuit module.
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