| 摘要 |
PURPOSE:To obtain a hybrid IC generating no radio interference at low cost by a method wherein the under surface of an insulating substrate combined with active and passive circuit elements is adhered closely to a heat dissipating plate, and a resin vessel whose inside surface is covered with a metal layer connected electrically to the heat dissipating plate is sealed to the insulating substrate. CONSTITUTION:A heat dissipating plate 4 is adhered closely to the under surface of an insulating substrate 1, a resin vessel 6 is covered on the substrate 1, and sealed hermetically between the heat dissipating plate 4. A metal layer 7 is formed inside of the vessel 6, and connected electrically to the heat dissipating plate 4 at a sealing part. Accordingly, circuit elements on the insulating substrate are screened completely, the influences of high-frequency waves between the inside and the outside exert no influence mutually, and a radio interference is not generated. The metal layer inside of the resin vessel can be formed by plating, evaporation, etc., a meshy type is also favorable, and can be formed at lower cost than the case to screen by a metal plate. |
