| 摘要 |
PURPOSE:To increase a thermocompression bonder in temperature to enable it to meet the temperature characteristics of solder and an outer lead to bond the outer lead by thermocompression by a method wherein cold air is made to blow against the thermocompression bonder, the bonder of comparatively low temperature is made to press an outer lead against the electrode of a board, and cold air is stopped to blow. CONSTITUTION:A heat transfer part 6 is made to come into contact with a thermocompression bonder 7, the bonder 7 is made to rise quickly in temperature, an electrode is fully fused by heating, an outer lead L is pressed against an electrode by the pushing force of a rod 25 of a cylinder 24, and the lead L is bonded to the electrode by thermocompression. The heat transfer part 6 is made to ascend to be distant from the thermocompression bonder 7 and stops transferring heat to the bonder 7, cold air is made to blow off from the lower end of an upright tube 2 through which a nozzle shaft is made to penetrate to cool down the thermocompression bonder 7 and the electrode to a temperature of 180 deg.C or below, and the bonder 7 is kept to press the outer lead against the electrode. When there is no fear that the outer lead leaps up, the bonder 7 is made to ascend to stop pressing the outer lead, the cold air is made to stop blowing off, the electrode is gradually cooled down and cured, and the outer lead L can surely be bonded to the electrode. |
