| 摘要 |
<p>PURPOSE:To enable a soldering work to be easily made on the outermost layer and a wiring board to have a required circuit function at all times by a method wherein an inner circuit pattern and an interlaminar conductor are formed of metal powder containing conductive resin composition, and at least the soldered part of the outermost circuit pattern is formed of metal foil. CONSTITUTION:An inner circuit pattern 2 is formed of conductive paste which contains synthetic resin as a binder component and composed of many layers which are arranged in a heat resistant plastic resin layer 1 such as a polysulfone resin layer and electrically insulated from each other. An outermost circuit pattern layer 3 where required electronic components are mounted and their leads are soldered is provided with a soldering part such as a pad, where required electronic components are mounted and their leads are soldered, is formed of a metal foil through a selective etching. An interlaminar conductor 5 is formed of conductive paste which contains synthetic resin as a binder component and electrically connects the inner circuit patterns 2 together, the inner circuit pattern 2 with the outer circuit pattern 3, and the outer circuit patterns 3 together through through-holes or viaholes.</p> |
