| 摘要 |
<p>The invention relates to a method for fabricating a hermetically sealed package around an integrated circuit said package consisting of two plates of thermoplastic material, at least one of which plates being provided with raised rims which abut the other plate or its rims and adjoined to one another at the contact faces, the join between the plates being obtained by means of a welding operation selected from the group consisting of ultrasonic welding, friction welding, laser welding and inductive welding, the surface condition of the contact faces being effected according to the welding technique employed.</p> |
