| 摘要 |
PURPOSE:To improve the reliability of a package by bringing the surface of the package and a tray body superposed to the upper section of the surface to a noncontact state. CONSTITUTION:A package 5 is carried under the state in which it is mounted onto a printed wiring board (a substrate) 3 for a test through a bump 4. When tray bodies 2 are superposed in trays 1 for carrying the packages, structure in which the surfaces of the packages 5 and the tray bodies 2 stacked to the upper sections of the surfaces of the packages 5 are brought to a noncontact state is formed. Consequently, the generation of foreign matters resulting from the contacts of the tray bodies 2 and the packages 5 are prevented. When the packages 5 are carried, the tray 1 for carrying the package at an uppermost stage plays the role of a cap for obviating foreign matters and dust from the outside, and no package 5 is housed in the package housing region 2a. |
