| 摘要 |
<p>PURPOSE:To prevent a fragment of a semiconductor chip from falling onto the surface of another semiconductor chip by isolating semiconductor chips and removing fragments thereof by means of two sheets of UV tape and finally picking up the semiconductor chips, while applying a UV tape on the back thereof, and placing the semiconductor chips in a chip tray. CONSTITUTION:A UV tape 3 is employed for separating a semiconductor wafer 1 along a dicing groove 1a into semiconductor chips 2 while a UV tape 5 is employed for beveling the back of the semiconductor chip 2 and the dicing groove 1a along the cross line thereof, an finally a UV tape 7 is applied onto the back of the semiconductor chips 2 in order to carry the semiconductor chips 2 into a chip tray. By such arrangement, fragments of a semiconductor chip is prevented from falling onto the surface of other semiconductor chips when the separated semiconductor chips are removed from the UV tape and carried into the chip tray.</p> |
